Air gap spacer formation for nano-scale semiconductor devices

ABSTRACT

Semiconductor devices having air gap spacers that are formed as part of BEOL or MOL layers of the semiconductor devices are provided, as well as methods for fabricating such air gap spacers. For example, a method comprises forming a first metallic structure and a second metallic structure on a substrate, wherein the first and second metallic structures are disposed adjacent to each other with insulating material disposed between the first and second metallic structures. The insulating material is etched to form a space between the first and second metallic structures. A layer of dielectric material is deposited over the first and second metallic structures using a pinch-off deposition process to form an air gap in the space between the first and second metallic structures, wherein a portion of the air gap extends above an upper surface of at least one of the first metallic structure and the second metallic structure.

TECHNICAL FIELD

The field relates generally semiconductor fabrication and, inparticular, to techniques for fabricating air gap spacers forsemiconductor devices.

BACKGROUND

As semiconductor manufacturing technology continues to evolve towardsmaller design rules and higher integration densities, the separationbetween adjacent structures in integrated circuits becomes increasinglysmaller. As such, unwanted capacitive coupling can occur betweenadjacent structures of integrated circuits such as adjacent metal linesin BEOL (back-end-of-line) interconnect structures, adjacent contacts(e.g., MOL (middle-of-the-line) device contacts) of FEOL(front-end-of-line) devices, etc. These structure-related parasiticcapacitances can lead to degraded performance of semiconductor devices.For example, capacitive coupling between transistor contacts can lead toincreased gate-to-source or gate-to-drain parasitic capacitances whichadversely impact the operational speed of a transistor, increase theenergy consumption of an integrated circuit, etc. In addition, unwantedcapacitive coupling between adjacent metal lines of a BEOL structure canlead to increased resistance-capacitance delay (or latency), crosstalk,increased dynamic power dissipation in the interconnect stack, etc.

In an effort to reduce parasitic coupling between adjacent conductivestructures, the semiconductor industry has adopted the use of lowdielectric constant (low-k) dielectrics and ultra-low-k (ULK)dielectrics (in place of conventional SiO₂ (k=4.0)) as insulatingmaterials for MOL and BEOL layers of ultra-large-scale integration(ULSI) integrated circuits. The advent of low-k dielectrics coupled withaggressive scaling, however, has led to critical challenges in thelong-term reliability of such low-k materials. For example, low-k TDDB(time-dependent dielectric breakdown) is commonly considered a criticalissue because low-k materials generally have weaker intrinsic breakdownstrength than traditional SiO₂ dielectrics. In general, TDDB refers tothe loss of the insulating properties of a dielectric when it issubjected to voltage/current bias and temperature stress over time. TDDBcauses an increase in leakage current and, thus, degrades performance innano-scale integrated circuits.

SUMMARY

Embodiments of the invention include semiconductor devices having airgap spacers that are formed as part of BEOL or MOL layers of thesemiconductor devices, as well as methods for fabricating air gapspacers as part of BEOL and MOL layers of a semiconductor device.

For example, a method for fabricating a semiconductor device comprisesforming a first metallic structure and a second metallic structure on asubstrate, wherein the first and second metallic structures are disposedadjacent to each other with insulating material disposed between thefirst and second metallic structures. The insulating material is etchedto form a space between the first and second metallic structures. Alayer of dielectric material is deposited over the first and secondmetallic structures to form an air gap in the space between the firstand second metallic structures, wherein a portion of the air gap extendsabove an upper surface of at least one of the first metallic structureand the second metallic structure.

In one embodiment, the first metallic structure comprises a first metalline formed in an interlevel dielectric layer of a BEOL interconnectstructure, and the second metallic structure comprises a second metalline formed in the ILD layer of the BEOL interconnect structure.

In another embodiment, the first metallic structure comprises a devicecontact, and the second metallic structure comprises a gate structure ofa transistor. In one embodiment, the device contact is taller than thegate structure, and the portion of the air gap extends above the gatestructure and below an upper surface of the device contact.

Other embodiments will be described in the following detaileddescription of embodiments, which is to be read in conjunction with theaccompanying figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are schematic views of a semiconductor device comprisingair gap spacers that are integrally formed within a BEOL structure ofthe semiconductor device, according to an embodiment of the invention.

FIGS. 2A and 2B schematically illustrate improvements in TDDBreliability and reduced capacitive coupling between metal lines of aBEOL structure, which are realized using air gap structures that areformed using pinch-off deposition methods according to embodiments ofthe invention, as compared to air gap structures that are formed usingconventional methods.

FIG. 3 is a cross-sectional schematic side view of a semiconductordevice comprising air gap spacers that are integrally formed within aBEOL structure of the semiconductor device, according to anotherembodiment of the invention.

FIGS. 4 through 10 schematically illustrate a method for fabricating thesemiconductor device of FIG. 1A, according to an embodiment of theinvention, wherein:

FIG. 4 is cross-sectional schematic side view of the semiconductordevice at an intermediate stage of fabrication in which a pattern ofopenings is formed in an ILD (inter-layer dielectric) layer;

FIG. 5 is cross-sectional schematic side view of the semiconductordevice of FIG. 4 after depositing a conformal layer of liner materialand depositing a layer of metallic material to fill the openings in theILD layer;

FIG. 6 is cross-sectional schematic side view of the semiconductordevice of FIG. 5 after planarizing the surface of the semiconductorstructure down to the ILD layer to form a metal wiring layer;

FIG. 7 is cross-sectional schematic side view of the semiconductordevice of FIG. 6 after forming protective caps on metal lines of themetal wiring layer;

FIG. 8 is cross-sectional schematic side view of the semiconductordevice of FIG. 7 after etching the ILD layer to form spaces between themetal lines of the metal wiring layer;

FIG. 9 is a cross-sectional schematic side view of the semiconductordevice of FIG. 8 after depositing a conformal layer of insulatingmaterial to form an insulating liner that covers exposed surfaces of themetal wiring layer and ILD layer; and

FIG. 10 is a cross-sectional schematic side view of the semiconductordevice of FIG. 9 which illustrates a process of depositing a dielectricmaterial using a non-conformal deposition process to cause pinch-offregions to begin forming in the deposited dielectric material over thespaces between the metal lines of the metal wiring layer.

FIG. 11 is a cross-sectional schematic side view of a semiconductordevice comprising air gap spacers that are integrally formed within aFEOL/MOL structure of the semiconductor device, according to anotherembodiment of the invention.

FIGS. 12 through 19 schematically illustrate a method for fabricatingthe semiconductor device of FIG. 11, according to an embodiment of theinvention, wherein:

FIG. 12 is cross-sectional schematic view of the semiconductor device atan intermediate stage of fabrication in which vertical transistorstructures are formed on a semiconductor substrate;

FIG. 13 is cross-sectional schematic side view of the semiconductordevice of FIG. 12 after patterning a pre-metal dielectric layer to formcontact openings between gate structures of the vertical transistorstructures;

FIG. 14 is cross-sectional schematic side view of the semiconductordevice of FIG. 13 after forming a conformal liner layer over the surfaceof the semiconductor device to line the contact openings with a linermaterial;

FIG. 15 is a cross-sectional schematic side view of the semiconductordevice of FIG. 14, after depositing a layer of metallic material to fillthe contact openings with metallic material and planarizing the surfaceof the semiconductor device to form MOL device contacts;

FIG. 16 is a cross-sectional side view of the semiconductor device ofFIG. 15 after recessing gate capping layers and sidewall spacers of thegate structures of the vertical transistor structures;

FIG. 17 is a cross-sectional schematic side view of the semiconductordevice of FIG. 16 after depositing a conformal layer of insulatingmaterial to form an insulating liner that lines the exposed surfaces ofthe gate structures and MOL device contacts;

FIG. 18 is a cross-sectional schematic side view of the semiconductordevice of FIG. 17 after depositing a dielectric material using anon-conformal deposition process to cause pinch-off regions that formair gaps in spaces between the gate structures and MOL device contacts;and

FIG. 19 is a cross-sectional schematic side view of the semiconductordevice of FIG. 18 after planarizing the surface of the semiconductordevice down to the MOL device contacts and depositing an ILD layer aspart of a first interconnect level of a BEOL structure.

DETAILED DESCRIPTION

Embodiments will now be described in further detail with regard tosemiconductor integrated circuit devices having air gap spacers that areformed as part of BEOL and/or MOL layers, as well as methods forfabricating air gap spacers as part of BEOL and/or MOL layers of asemiconductor integrated circuit device. In particular, as explained infurther detail below, embodiments of the invention include methods forfabricating air gap spacers using “pinch-off” deposition techniqueswhich utilize certain dielectric materials and deposition techniques tocontrol the size and shape of the air gap spacers that are formed and,thereby, optimize air gap spacer formation for a target application. Theexemplary pinch-off deposition methods as discussed herein to form airgap spacers provide improved TDDB reliability as well as optimalcapacitance reduction in BEOL and MOL layers of semiconductor integratedcircuit devices.

It is to be understood that the various layers, structures, and regionsshown in the accompanying drawings are schematic illustrations that arenot drawn to scale. In addition, for ease of explanation, one or morelayers, structures, and regions of a type commonly used to formsemiconductor devices or structures may not be explicitly shown in agiven drawing. This does not imply that any layers, structures, andregions not explicitly shown are omitted from the actual semiconductorstructures.

Furthermore, it is to be understood that the embodiments discussedherein are not limited to the particular materials, features, andprocessing steps shown and described herein. In particular, with respectto semiconductor processing steps, it is to be emphasized that thedescriptions provided herein are not intended to encompass all of theprocessing steps that may be required to form a functional semiconductorintegrated circuit device. Rather, certain processing steps that arecommonly used in forming semiconductor devices, such as, for example,wet cleaning and annealing steps, are purposefully not described hereinfor economy of description.

Moreover, the same or similar reference numbers are used throughout thedrawings to denote the same or similar features, elements, orstructures, and thus, a detailed explanation of the same or similarfeatures, elements, or structures will not be repeated for each of thedrawings. It is to be understood that the terms “about” or“substantially” as used herein with regard to thicknesses, widths,percentages, ranges, etc., are meant to denote being close orapproximate to, but not exactly. For example, the term “about” or“substantially” as used herein implies that a small margin of error ispresent, such as 1% or less than the stated amount.

FIGS. 1A and 1B are schematic views of a semiconductor device 100comprising air gap spacers that are integrally formed within a BEOLstructure of the semiconductor device, according to an embodiment of theinvention. FIG. 1A is a schematic cross-sectional side view of thesemiconductor device 100 taken along line 1A-1A in FIG. 1B, and FIG. 1Bis a schematic plan view of the semiconductor device 100 along a planethat includes line 1B-1B as shown in FIG. 1A. More specifically, FIG. 1Ais a schematic cross-sectional side view of the semiconductor device 100in an X-Z plane, and FIG. 1B is a plan view showing a layout of variouselements within an X-Y plane, as indicated by the respective XYZCartesian coordinates shown in FIGS. 1A and 1B. It is to be understoodthat the term “vertical” or “vertical direction” as used herein denotesa Z-direction of the Cartesian coordinates shown in the figures, and theterm “horizontal” or “horizontal direction” as used herein denotes anX-direction and/or Y-direction of the Cartesian coordinates shown in thefigures.

In particular, FIG. 1A schematically illustrates the semiconductordevice 100 comprising a substrate 110, a FEOL/MOL structure 120, and aBEOL structure 130. In one embodiment, the substrate 110 comprises abulk semiconductor substrate formed of, e.g., silicon, or other types ofsemiconductor substrate materials that are commonly used in bulksemiconductor fabrication processes such as germanium, silicon-germaniumalloy, silicon carbide, silicon-germanium carbide alloy, or compoundsemiconductor materials (e.g. III-V and II-VI). Non-limiting examples ofcompound semiconductor materials include gallium arsenide, indiumarsenide, and indium phosphide. The thickness of the base substrate 100will vary depending on the application. In another embodiment, thesubstrate 110 comprises a SOI (silicon on insulator) substrate, whichcomprises an insulating layer (e.g., oxide layer) disposed between abase semiconductor substrate (e.g., silicon substrate) and an activesemiconductor layer (e.g., active silicon layer) in which active circuitcomponents (e.g., field effect transistors) are formed as part of a FEOLlayer.

In particular, the FEOL/MOL structure 120 comprises a FEOL layer formedon the substrate 110. The FEOL layer comprises various semiconductordevices and components that are formed in or on the active surface ofthe semiconductor substrate 110 to provide integrated circuitry for atarget application. For example, the FEOL layer comprises FET devices(such as FinFET devices, planar MOSFET device, etc.), bipolartransistors, diodes, capacitors, inductors, resistors, isolationdevices, etc., which are formed in or on the active surface of thesemiconductor substrate 110. In general, FEOL processes typicallyinclude preparing the substrate 110 (or wafer), forming isolationstructures (e.g., shallow trench isolation), forming device wells,patterning gate structures, forming spacers, forming source/drainregions (e.g., via implantation), forming silicide contacts on thesource/drain regions, forming stress liners, etc.

The FEOL/MOL structure 120 further comprises a MOL layer formed on theFEOL layer. In general, the MOL layer comprises a PMD (pre-metaldielectric layer) and conductive contacts (e.g., via contacts) that areformed in the PMD layer. The PMD layer is formed on the components anddevices of the FEOL layer. A pattern of openings is formed in the PMDlayer, and the openings are filled with a conductive material, such astungsten, to form conducive via contacts that are in electrical contactwith device terminals (e.g., source/drain regions, gate contacts, etc.)of the integrated circuitry of the FEOL layer. The conductive viacontacts of the MOL layer provide electrical connections between theintegrated circuitry of the FEOL layer and a first level ofmetallization of the BEOL structure 130.

The BEOL structure 130 is formed on the FEOL/MOL structure 120 toconnect the various integrated circuit components of the FEOL layer. Asis known in the art, a BEOL structure comprises multiple levelsdielectric material and levels of metallization embedded in thedielectric material. The BEOL metallization comprises horizontal wiring,interconnects, pads, etc., as well as vertical wiring in the form ofconductive vias that form connections between different interconnectlevels of the BEOL structure. A BEOL fabrication process involvessuccessive depositing and patterning of multiple layers of dielectricand metallic material to form a network of electrical connectionsbetween the FEOL devices and to provide I/O connections to externalcomponents.

In the example embodiment of FIG. 1A, the BEOL structure 130 comprises afirst interconnect level 140, and a second interconnect level 150. Thefirst interconnect level 140 is generically depicted, and can includeone more low-k inter-level dielectric (ILD) layers and metallic via andwiring levels (e.g., copper damascene structures). A capping layer 148is formed between the first interconnect level 140 and the secondinterconnect level 150. The capping layer 148 serves to insulatemetallization of the first interconnect level 140 from the dielectricmaterial of the ILD layer 151. For example, the capping layer 148 servesto improve interconnect reliability and prevent copper metallizationfrom diffusing into the ILD layer 151 of the second interconnect level150. The capping layer 148 may include any suitable insulating ordielectric material including, but not limited to, silicon nitride(SiN), silicon carbide (SiC), silicon carbon nitride (SiCN),hydrogenated silicon carbide (SiCH), a multilayer stack comprising thesame or different types of dielectric materials, etc. The capping layer148 can be deposited using standard deposition techniques, for example,chemical vapor deposition. The capping layer 148 can be formed with athickness in a range from about 2 nm to about 60 nm.

The second interconnect level 150 comprises an ILD layer 151 and a metalwiring layer 152 formed in the ILD layer 151. The ILD layer 151 can beformed using any suitable dielectric material including, but not limitedto, silicon oxide (e.g. SiO2), SiN (e.g., (Si3N4), hydrogenated siliconcarbon oxide (SiCOH), silicon based low-k dielectrics, porousdielectrics, or other known ULK (ultra-low-k) dielectric materials. TheILD layer 151 can be deposited using known deposition techniques, suchas, for example, ALD (atomic layer deposition), CVD (chemical vapordeposition) PECVD (plasma-enhanced CVD), or PVD (physical vapordeposition). The thickness of the ILD layer 151 will vary depending onthe application, and may have a thickness in a range of about 30 nm toabout 200 nm, for example.

The metal wiring layer 152 comprises a plurality of closely spaced metallines 152-1, 152-2, 152-3, 152-4, 152-5, and 152-6, which are formedwithin trenches/openings that are patterned in the ILD layer 151 andfilled with metallic material to form the metal lines. Thetrenches/openings are lined with a conformal liner layer 153 whichserves as a barrier diffusion layer to prevent migration of the metallicmaterial (e.g., Cu) into the ILD layer 151, as well as an adhesion layerto provide good adhesion to the metallic material (e.g., Cu) that isused to fill the trenches/openings in the ILD layer 151 and form themetal lines 152-1, . . . , 152-6.

As further depicted in FIG. 1A, the second interconnect level 150further comprises protective caps 154 that are selectively formed on anupper surface of the metal lines 152-1, 152-2, 152-3, 152-4, 152-5, and152-6, a conformal insulating liner 155 that conformally covers themetal wiring layer 152, and a dielectric capping layer 156 that isdeposited using a pinch-off deposition technique to form air gap spacers158 between the metal lines 152-1, 152-2, 152-3, 152-4, 152-5, and152-6. The protective caps 154 and conformal insulating liner 155 serveto protect the metal wiring 152 from potential structural damage orcontamination which can result from subsequent processing steps andenvironmental conditions. Example materials and methods for forming theprotective caps 154 and the conformal insulating liner 155 will bediscussed in further detail below with reference to FIGS. 7-9.

The air gap spacers 158 are formed in spaces between the metal lines152-1, 152-2, 152-3, 152-4, 152-5, and 152-6 of the metal wiring layer152 as a means to decrease the parasitic capacitive coupling betweenadjacent metal lines of the metal wiring layer 152. As explained infurther detail below, a dielectric air gap integration process isperformed as part of the BEOL fabrication process in which portions ofthe dielectric material of the ILD layer 151 are etched away to formspaces between the metal lines metal lines 152-1, 152-2, 152-3, 152-4,152-5, and 152-6 of the wiring layer 152. The dielectric capping layer156 is formed using a non-conformal deposition process (e.g., chemicalvapor deposition) to deposit a dielectric material which forms“pinch-off” regions 156-1 above the upper portions of the spaces betweenthe metal lines of the wiring layer 152, thereby forming the air gapspacers 158. As shown in FIG. 1A, in one embodiment of the invention,the pinch-off regions 156-1 are formed above the upper surfaces of themetal lines 152-1, . . . , 152-6 of the metal wiring layer 152, asindicated by the dashed line 1B-1B. In this regard, the air gap spacers158 that are formed between the metal lines 152-1, . . . , 152-6vertically extend into the dielectric capping layer 156 above the metallines 152-1, . . . , 152-6.

Furthermore, in one embodiment of the invention, as shown in FIG. 1B,the air gap spacers 158 formed between the metal lines 152-1, . . . ,152-6 horizontally extend (e.g., in the Y-direction) past end portionsof adjacent metal lines. In particular, FIG. 1B shows an exampleinterdigitated comb-comb layout pattern of the metal wiring layer 152wherein the metal lines 152-1, 152-3, and 152-5 are commonly connectedat one end to an elongated metal line 152-7, and wherein the metal lines152-2, 152-4, and 152-6 are connected at one end to an elongated metalline 152-8. As shown in FIG. 1B, the air gap spacers 158 horizontallyextend past the open (unconnected) ends of the metal lines 152-1, . . ., 152-6. As compared to conventional air gap structures, the size andshape of the air gap spacers 158 shown in FIGS. 1A and 1B provideimproved TDDB reliability, as well as reduced capacitive couplingbetween the metal lines, for reasons that will now be discussed infurther detail with reference to FIGS. 2A and 2B.

FIGS. 2A and 2B schematically illustrate improvements in TDDBreliability and reduced capacitive coupling between metal lines of aBEOL structure, which are realized using air gap structures that areformed using pinch-off deposition methods according to embodiments ofthe invention, as compared to air gap structures that are formed usingconventional methods. In particular, FIG. 2A schematically illustrates aportion of the metal wiring layer 152 of FIG. 1A including the metallines 152-1 and 152-2, and the air gap 158 which is formed between themetal lines by forming the dielectric capping layer 156 using apinch-off deposition process according to an embodiment of theinvention. As depicted in FIG. 2A, the metal lines 152-1 and 152-2 andassociated liners 153 are formed to have a width W, and are spaced apartby a distance S. Further, FIG. 2B schematically illustrates asemiconductor structure comprising an air gap 168 that is disposedbetween the same two metal lines 152-1 and 152-2 having the same width Wand spacing S as in FIG. 2A, but wherein the air gap 168 is formed byforming a dielectric capping layer 166 using a conventional pinch-offdeposition process.

As shown in FIG. 2A, the “pinch-off” region 156-1 is formed in thedielectric capping layer 156 such that the air gap 158 extends above theupper surface of the metal lines 152-1 and 152-2. In contrast, as shownin FIG. 2B, a conventional pinch-off deposition process results in theformation of a pinch-off region 166-1 in the dielectric capping layer166 below the upper surface of the metal lines 152-1 and 152-2 such thatthe resulting air gap 168 does not extend above the metal lines 152-1and 152-2. Furthermore, as comparatively illustrated in FIGS. 2A and 2B,the amount of dielectric material that is deposited on the sidewall andbottom surfaces in the space between the metal lines 152-1 and 152-2 asshown in FIG. 2B using a conventional pinch-off deposition process issignificantly greater than the amount of dielectric material that isdeposited on the sidewall and bottom surfaces in the space between themetal lines 152-1 and 152-2 as shown in FIG. 2A using a pinch-offdeposition process according to an embodiment of the invention. As aresult, a volume V1 of the resulting air gap 158 in FIG. 2A issignificantly greater than a volume V2 of the resulting air gap 168shown in FIG. 2B.

There are various advantages associated with the structure in FIG. 2A ascompared to the conventional structure shown in FIG. 2B. For example,the larger volume V1 of the air gap 158 (with less dielectric materialdisposed in the space between the metal lines) results in a smallerparasitic capacitance between the metal lines metal lines 152-1 and152-2 (as compared to the structure of FIG. 2B). Indeed, there is areduced effective dielectric constant in the space between metal lines152-1 and 152-2 in FIG. 2A as compared to FIG. 2B since there is lessdielectric material and a large volume V1 of air (k=1) in the spacebetween the metal lines 152-1 and 152-2 of FIG. 2A.

In addition, the structure of FIG. 2A provides improved TDDB reliabilityas compared to the structure of FIG. 2B. In particular, as shown in FIG.2A, since the air gap 158 extends above the metal lines 152-1 and 152-2,there is a long diffusion/conducting path P1 between the criticalinterfaces of the metal lines 152-1 and 152-2 (the critical interfacesbeing an interface between the dielectric capping layer 156 and theupper surfaces of the metal lines 152-1 and 152-2). This is in contrastto a shorter diffusion/conducting path P2 in the dielectric cappinglayer 166 between the critical interfaces of the metal lines 152-1 and152-2 in the structure shown in FIG. 2B. A TDDB failure mechanism in thestructure of FIG. 2A or 2B would result from the breakdown of thedielectric material and the formation of a conducting path through thedielectric material between the upper surfaces of the metal lines 152-1and 152-2 due to electron tunneling current. The longer diffusion pathP1 in the structure shown in FIG. 2A, coupled with the optional use of adense dielectric liner 155 material with superior dielectric breakdownstrength, would provide improved TDDB reliability of the structure inFIG. 2A as compared to the structure shown in FIG. 2B.

Furthermore, the horizontal extension of the air gap spacers 158 pastthe end portions of the metal lines as shown in FIG. 1B would furtheradd to an improvement in TDDB reliability and reduced capacitivecoupling for the same reasons discussed with reference to FIG. 2A. Inparticular, as shown in FIG. 1B, the extension of the air gap 158 pastthe end of the metal line 152-1, for example, would provide a longdiffusion/conducting path between the critical interface at the open endof the metal line 152-1 and the adjacent metal line 152-2. In analternate embodiment of FIG. 1B, air gap spacers could be formed betweenthe elongated metal line 152-8 and the adjacent open ends of the metallines 152-1, 152-2 and 152-5, and air gap spacers could be formedbetween the elongated metal line 152-7 and the adjacent open ends of themetal lines 152-2, 152-4, and 152-6, to thereby further optimize TDDBreliability and reduce capacitive coupling between the interdigitatedcomb structures.

FIG. 3 is a cross-sectional schematic side view of a semiconductordevice comprising air gap spacers that are integrally formed within aBEOL structure of the semiconductor device, according to anotherembodiment of the invention. In particular, FIG. 3 schematicallyillustrates a semiconductor device 100′ which is similar in structure tothe semiconductor device 100 shown in FIGS. 1A/1B, except that the airgap spacers 158 shown in FIG. 3 do not extend past a bottom surface ofthe metal lines of the metal wiring layer 152. With this structure, theILD layer 151 would be recessed down to the bottom level of the metallines (as compared to being recessed below the bottom of the metallines, as shown in FIG. 8, to form the extended air gap spacers shown inFIG. 1A.) In other embodiments of the invention, while FIGS. 1A and 3show the BEOL structure 130 having first and second interconnect levels140 and 150, the BEOL structure 130 can have one or more additionalinterconnect levels formed over the second interconnect level 150. Suchadditional interconnect levels can be formed with air gap spacers usingtechniques and materials as discussed herein.

Methods for fabricating the semiconductor device 100 of FIG. 1A (andFIG. 3) will now be discussed in further detail with reference to FIGS.4 through 10, which schematically illustrate the semiconductor device100 at various stages of fabrication. For example, FIG. 4 iscross-sectional schematic view of the semiconductor device 100 at anintermediate stage of fabrication in which a pattern of openings 151-1(e.g., damascene openings comprising trenches and via openings) areformed in the ILD layer 151, according to an embodiment of theinvention. In particular, FIG. 4 schematically illustrates thesemiconductor device 100 of FIG. 1A at an intermediate stage offabrication after sequentially forming the FEOL/MOL structure 120, thefirst interconnect level 140, the capping layer 148, and the ILD layer151 on top of substrate 110, and after patterning the ILD layer 151 toform the openings 151-1 in the ILD layer 151. After depositing the ILDlayer 151, standard photolithography and etch processes can be performedto etch the openings 151-1 in the ILD layer 151, which are subsequentlyfilled with metallic material to form the metal wiring layer 152 of FIG.1A. It is to be noted that while no vertical vias are shown in the ILDlayer 151, it is to be understood that vertical vias would exist in thesecond interconnect level 150 to provide vertical connections tometallization in the underlying interconnect level 140.

In FIG. 4, the openings 151-1 are shown to have a width W and spacedapart by a distance S. In one embodiment of the invention, in thecontext of forming air gap spacers between closely-spaced metal linesusing pinch-off deposition methods, the width W of the openings (inwhich the metal lines are formed) can be in a range of about 2 nm toabout 25 nm with a preferred range of about 6 nm to about 10 nm.Furthermore, in one embodiment, the spacing S between the metal linescan be in a range of about 2 nm to about 25 nm with a preferred rangefrom about 6 nm to about 10 nm.

A next process module in the exemplary fabrication process comprisesforming the metal wiring layer 152 shown in FIG. 1A using a process flowas schematically illustrated in FIGS. 5 and 6. In particular, FIG. 5 iscross-sectional schematic view of the semiconductor device of FIG. 4after depositing a conformal layer of liner material 153A and depositinga layer of metallic material 152A on the conformal layer of linermaterial 153A to fill the openings 151-1 in the ILD layer 151. Inaddition, FIG. 6 is cross-sectional schematic view of the semiconductordevice of FIG. 5 after planarizing the surface of the semiconductorstructure down to the ILD layer 151 to form the metal wiring layer 152.The metal wiring layer 152 can be formed using known materials and knowntechniques.

For example, the conformal layer of liner material 153A is preferablydeposited to line the sidewall and bottom surfaces of the openings 151-1in the ILD layer 151 with a thin liner layer. The thin liner layer maybe formed by conformally depositing one or more thin layers of materialsuch as, for example, tantalum nitride (TaN), cobalt (Co), or ruthenium(Ru), or manganese (Mn) or manganese nitride (MnN) or other linermaterials (or combinations of liner materials such as Ta/TaN, TiN, CoWP,NiMoP, NiMoB) which are suitable for the given application. The thinliner layer serves multiple purposes. For example, the thin liner layerserves as a barrier diffusion layer to prevent migration/diffusion ofthe metallic material (e.g., Cu) into the ILD layer 151. In addition,the thin liner layer serves as an adhesion layer to provide goodadhesion to the layer of metallic material 152A (e.g., Cu) that is usedto fill the openings 151-1 in the ILD layer 151.

In one embodiment, the layer of metallic material 152A comprises ametallic material such as, for example, copper (Cu), aluminum (Al),tungsten (W), cobalt (Co), or ruthenium (Ru), which is deposited usingknown techniques such as electroplating, electroless plating, CVD, PVD,or a combination of methods. Prior to filling the openings 151-1 in theILD layer 151 with the conductive material, a thin seed layer (e.g., Cuseed layer) may optionally be deposited (on the conformal liner layer153A) using a suitable deposition technique such as ALD, CVD or PVD. Theseed layer can be formed of a material which enhances adhesion of themetallic material on the underlying material and which serves ascatalytic material during a subsequent plating process. For example, athin conformal Cu seed layer can be deposited over the surface of thesubstrate using PVD, followed by the electroplating of Cu to fill theopenings 151-1 (e.g., trenches and vias) formed in the ILD layer 151and, thus, form a Cu metallization layer 152. The overburden liner,seed, and metallization materials are then removed by performing achemical mechanical polishing process (CMP) to planarize the surface ofthe semiconductor structure down to the ILD layer 151, resulting in theintermediate structure shown in FIG. 6.

In one embodiment of the invention, after performing the CMP process, aprotective layer may be formed on the exposed surfaces of the metallines 152-1, . . . , 152-6 to protect the metallization from potentialdamage as a result of subsequent processing conditions and environments.For example, FIG. 7 is cross-sectional schematic view of thesemiconductor device of FIG. 6 after forming protective caps 154 on themetal lines 152-1, . . . , 152-6, according to an embodiment of theinvention. In one embodiment, for copper metallization, the protectivecaps 154 may be formed using a selective Co deposition process toselectively deposit a thin capping layer of Co on the exposed surfacesof the metal lines 152-1, . . . , 152-6. In other embodiments of theinvention, the protective caps 154 can be formed of other materials suchas tantalum (Ta) or ruthenium (Ru). The protective caps 154 on the metallines 152-1, . . . , 152-6 are optional features that can be utilized,if desired, to allow for more aggressive etching conditions, etc., whenforming air gap spacers and other structures using techniques discussedhereafter.

A next step in the fabrication process comprises forming air gap spacersin the second interconnect level 150 using a process flow asschematically depicted in FIGS. 8, 9 and 10. In particular, FIG. 8 iscross-sectional schematic view of the semiconductor device of FIG. 7after etching exposed portions of the ILD layer 151 to form spaces 151-2between the metal lines 152-1, . . . , 152-6, according to an embodimentof the invention. In one embodiment, any suitable masking (e.g.,photoresist mask) and etching technique (e.g., RIE (reactive ion etch))can be used to recess portions of the ILD layer 151 and form the spaces151-2, as shown in FIG. 8. For example, in one embodiment, a dry etchtechnique using a fluorine-based etchant can be used to etch away thedielectric material of the ILD layer 151 to form the spaces 151-2. Inone embodiment, the spaces 151-2 are formed such that the recessedsurface of the ILD layer 151 is below the bottom surfaces of the metallines 152-1, . . . , 152-6, as shown in FIG. 8. In another embodiment,the etch process can be performed such that the spaces 151-2 arerecessed down to a level of the bottom surfaces of the metal wiring 152(see FIG. 3). In regions of the metal wiring 152 where metal lines arespaced relatively far apart, the ILD layer 151 is not removed, since theinterline capacitance between the widely spaced metal lines is assumedto be negligible.

A next step in the process comprises depositing a conformal layer ofinsulating material over the semiconductor structure of FIG. 8 to formthe conformal insulating liner 155 as shown in FIG. 9. The conformalinsulating liner 155 is an optional protective feature that may beformed prior to the pinch-off deposition process to provide addedprotection to the exposed surfaces of the ILD layer 151 and metal wiringlayer 152. For example, in the example embodiment of FIG. 9, while theconformal liner layers 153 provide some protection to the sidewalls ofthe metal lines 152-1, . . . , 152-6, the conformal insulating liner 155can provided added protection against oxidation of the metal lines152-1, . . . , 152-6, when the metal lines are formed of copper and theliner layers 153 are not sufficient to prevent diffusion of oxygen intothe metal lines from the air gap spacers 158 that are subsequentlyformed. Indeed, while the air gap spacers 158 as subsequently formed tohave a near vacuum environment, there still exists some level of oxygenin the air gap spacers 158 which can lead to oxidation of the coppermetal lines in instances when the liner layers 153 allow residual oxygenin the air gap spacers 158 to diffuse through the liner layers 153 tothe metal lines.

Further, the conformal insulating liner 155 can be formed with one ormore robust ultrathin layers of dielectric material which have desiredelectrical and mechanical characteristics such as low leakage, highelectrical breakdown, hydrophobic, etc., and which can sustain lowdamage from subsequent semiconductor processing steps. For example, theconformal insulating liner 155 can be formed of a dielectric materialsuch as SiN, SiCN, SiNO, SiCNO, SiBN, SiCBN, SiC, or other dielectricmaterials having desired electrical/mechanical properties as notedabove. In one embodiment, the conformal insulating liner 155 is formedwith a thickness in a range of about 0.5 nm to about 5 nm. The conformalinsulating liner 155 can be formed of multiple conformal layers of thesame or different dielectric materials, which are deposited using acyclic deposition process. For example, in one embodiment, the conformalinsulating liner 155 can be formed of multiple thin conformal layers ofSiN (e.g., 0.1 nm-0.2 nm thick SiN layers) which are sequentiallydeposited to form a SiN liner layer that has a total desired thickness.

As shown in FIG. 9, after formation of the conformal insulating liner155, the spaces 151-2 between the metal lines of the metal wiring layer152 are shown to have an initial volume Vi. In particular, in oneembodiment where the conformal insulating liner 155 is formed, thevolume Vi is defined by the sidewall and bottom surfaces of theconformal insulating liner 155 and a dashed line L that denotes an uppersurface of the conformal insulating liner 155 on the metal wiring layer152. In another embodiment of the invention, when the conformalinsulating liner 155 is not formed, the initial volume Vi would bedefined by the exposed surfaces of the liner layers 153, the recessedsurface of the ILD layer 151, and an upper surface of the metal lines ofthe metal wiring layer 152. As discussed below, a significant portion ofthe initial volume Vi remains in the spaces 151-2 between the metallines, after formation of the air gap spacers 158 using a pinch-offdeposition process according to an embodiment of the invention.

A next step in the fabrication process comprises depositing dielectricmaterial over the semiconductor structure of FIG. 9 using a pinch-offdeposition process to form the air gap spacers 158 in the spacer 151-2between the metal lines of the metal wiring layer 152. For example, FIG.10 schematically illustrates a process of depositing a layer ofdielectric material 156A using a non-conformal deposition process (e.g.,PECVD or PVD) to cause pinch-off regions to begin forming in thedeposited dielectric material 156A over the spaces 151-2 between themetal lines of the metal wiring layer 152, according to an embodiment ofthe invention. FIG. 1A illustrates the semiconductor device 100 at thecompletion of the pinch-off deposition process in which the dielectriccapping layer 156 is formed with pinch-off regions 156-1 in thedielectric capping layer and air gap spacers 158 formed in the spaces151-2 between the metal lines of the metal wiring layer 152.

In accordance with embodiments of the invention, the structuralcharacteristics (e.g., size, shape, volume, etc.) of the air gap spacersthat are formed by pinch-off deposition can be controlled, for example,based on (i) the type of dielectric material(s) that are used to formthe dielectric capping layer 156, and/or (ii) the deposition process andassociated deposition parameters (e.g., gas flow rate, RF power,pressure, deposition rate, etc.) that are used to perform the pinch-offdeposition. For example, in one embodiment of the invention, the cappinglayer 158 is formed by PECVD deposition of a low-k dielectric material(e.g., kin a range of about 2.0 to about 5.0). Such low-k dielectricmaterial includes, but is not limited to, SiCOH, porous p-SiCOH, SiCN,carbon-rich SiCNH, p-SiCNH, SiN, SiC, etc. A SiCOH dielectric materialhas a dielectric constant k=2.7, and a porous SiCOH material has adielectric constant of about 2.3-2.4. In one example embodiment of theinvention, a pinch-off deposition process is implemented by depositing aSiCN dielectric film via a plasma CVD deposition process using anindustrial parallel plate single wafer 300 mm CVD reactor with thefollowing deposition parameters: Gas [Trimethyl Silane (200-500 standardcubic centimeter per minute (sccm)) and Ammonia (300-800 sccm)]; RFpower [300-600 Watts]; Pressure [2-6 Torr]; and deposition rate [0.5-5nm/sec].

Furthermore, the level of conformality of the PECVD deposited dielectricmaterial can be controlled to achieve “pinch-off” of the dielectriccapping layer either above the surface of adjacent metal lines or belowthe surface of adjacent metal lines. The term “level of conformality” ofan insulating/dielectric film deposited over a trench with an aspectratio R of 2 (wherein R=trench depth/trench opening) is defined hereinas a ratio of the thickness of the insulating/dielectric film asdeposited on a sidewall at the middle of the trench location divided bythe thickness of the insulating/dielectric film at the top of the trenchlocation. For example, a 33% level of conformality of aninsulating/dielectric film with thickness of 3 nm deposited over atrench structure with an opening of 12 nm and a depth of 24 nm depth(aspect ratio 2) should have about 1 nm in thickness on the sidewall inthe middle of the trench and 3 nm on top of the trench (level ofconformality=1 nm/3 nm ˜33%).

For example, for a level of conformality that is about 40% and less, the“pinch-off” regions 156-1 as shown in FIG. 1A are formed in thedielectric capping layer 156 above the metal lines of the metal wiringlayer 152. This results in the formation of the air gap spacers 158which extend above the metal lines of the metal wiring layer 152. On theother hand, for a level of conformality which is greater than about 40%,the “pinch-off” regions would be formed in the dielectric capping layerbelow the upper surface of the metal lines of the metal wiring layer152. This would result in the formation of air gap spacers which do notextend above the metal lines of the metal wiring layer 152.

Depending on the given application and the dimensions of the air gap/airspacer structures, a target level of conformality of the PECVD depositeddielectric material can be achieved by adjusting the deposition processparameters. For example, for PECVD dielectric materials such as SiN,SiCN, SiCOH, porous p-SiCOH, and other ULK dielectric materials, a lowerlevel of conformality can be obtained by increasing the RF power,increasing the pressure and/or increasing the deposition rate (e.g.,increase flow rate of precursor materials). As the level of conformalitydecreases, the “pinch-off” regions are formed above the metal lines withminimal deposition of the dielectric material on the exposed sidewalland bottom surfaces within the spaces 151-2, resulting in the formationof large, voluminous air gap spacers 158 which extend above the metallines of the metal wiring layer 152, as shown in FIGS. 1A and 3, forexample.

It is to be noted that experimental BEOL test structures such as shownin FIGS. 1A and 3 have been fabricated in which non-conformal cappinglayers (conformality less than 40%) comprising ULK materials (e.g.,SiCOH, porous p-SiCOH) have been formed using “pinch-off” depositionmethods discussed herein to obtain large, voluminous air gap spacersbetween closely spaced meta lines, wherein the air gap spacers extendabove the metal lines, as shown in FIGS. 1A and 3. Moreover,experimental results have shown that pinch-off deposition of suchnon-conformal capping layers results in very little deposition ofdielectric material on the sidewalls and bottom surfaces of the airspaces between the metal lines. In particular, assuming that the spaces151-2 between the metal lines have an initial volume Vi prior toformation of the capping layer (as shown in FIG. 9), the experimentalBEOL test structures have been fabricated in which a resulting volume ofabout nVi (wherein n is in a range of about 0.70 to nearly 1.0) has beenachieved after forming the air gap spacers using a non-conformalpinch-off deposition process as described herein.

The dielectric constant of air is about unity, which is much less thanthe dielectric constant of the dielectric materials that are used toform the conformal insulating liner 155 and the dielectric capping layer156. In this regard, the ability to tightly control and minimize theamount of dielectric material that is deposited within the spaces 151-2between adjacent metal lines of the metal wiring layer 152 usingtechniques as discussed herein enables optimization of the electricalperformance of BEOL structures by reducing the effective dielectricconstant (and thus the parasitic capacitance) between adjacent metallines of the metal wiring layer 152. Moreover, the ability to performpinch-off deposition using ULK dielectric materials to form a low-kdielectric capping layer 156 and large voluminous air gap spacers 158,results in an overall decrease in the effective dielectric constant (andthus reduced parasitic capacitance) of the BEOL structure.

While exemplary embodiments of the invention discussed above illustratethe formation of air gap spacers as part of BEOL structures, similartechniques can be applied to form air gap spacers as part of FEOL/MOLstructures to reduce parasitic coupling between adjacent FEOL/MOLstructures. For example, air gap spacers can be formed between MOLdevice contacts and metallic gate structures of vertical transistordevices in an FEOL/MOL structure using techniques as will be discussednow in further detail with reference to FIGS. 11-19.

FIG. 11 is a cross-sectional schematic side view of a semiconductordevice comprising air gap spacers that are integrally formed within aFEOL/MOL structure of the semiconductor device, according to anotherembodiment of the invention. In particular, FIG. 11 schematicallyillustrates a semiconductor device 200 comprising a substrate 210/215which includes a bulk substrate layer 210 and an insulating layer 215(e.g., a buried oxide layer of an SOI substrate), and a plurality ofvertical transistor structures M1, M2, M3 (see FIG. 12) formed on thesubstrate 210/215. The vertical transistor structures M1, M2, M3 have astandard structural framework comprising a semiconductor fin 220 (whichextends along the substrate in an X direction), epitaxially grown source(S)/drain (D) regions 225, and respective metal gate structures 230-1,230-2, and 230-3. The semiconductor fin 220 serves as a vertical channelfor the vertical transistor structures M1. M2, M3 in regions of thesemiconductor fin 220 that are surrounded by the respective metal gatestructures 230-1, 230-2, 230-3. The semiconductor fin 220 can be formedby etching/patterning an active silicon layer that is formed on top ofthe insulating layer 215 (e.g., an SOI layer of an SOI substrate). Thesemiconductor fin 220 is not specifically shown in FIG. 11, but an uppersurface of the semiconductor fin 220 is depicted by the dashed line inFIG. 11 (i.e., channel portions of the semiconductor fin 220 are coveredby the gate structures 230-1, 230-2 and 230-3, and portions of thesemiconductor fin 220 extending from the gate structures areencapsulated in epitaxial material that grown on the exposed surfaces ofthe semiconductor fin 220).

In one embodiment, the metal gate structures 230-1, 230-2, and 230-3each comprise a conformal high-k metal gate stack structure formed on avertical sidewall and upper surface of the semiconductor fin 220, and agate electrode formed over the high-k metal gate stack structure. Eachconformal high-k metal gate stack structure comprises a conformal layerof gate dielectric material (e.g., high-k dielectric material such asHfO₂, Al₂O₃, etc.) formed on the sidewall and upper surface of thesemiconductor fin 220, and a conformal layer of metallic work functionmetal material (e.g., Zr, W, Ta, Hf, Ti, Al, Ru, Pa, TaN, TiN, etc.)formed on the conformal layer of gate dielectric material. The gateelectrode material that is formed on the high-k metal gate stackstructure comprises a low-resistance conductive material including, butnot limited to tungsten, aluminum, or any metallic or conductivematerial that is commonly used to form gate electrode structures.

The epitaxial source (S)/drain (D) regions 225 include epitaxialsemiconductor material (e.g., SiGe, III-V compound semiconductormaterial, etc.) that is epitaxially grown on exposed portions of thesemiconductor fin structures 220 which extend out from the metal gatestructures 230-1, 230-2, 230-3. A plurality of MOL device contacts240/245 are formed as part of a MOL layer of the semiconductor device200 to provide vertical contacts to the source/drain regions 225. EachMOL device contact 240/245 comprises a liner/barrier layer 240 and aconductive via 245.

As further shown in FIG. 11, the metal gate structures 230-1, 230-2,230-3 are electrically insulated from the MOL contacts 240/245 and othersurrounding structures by insulating material layers 234, 250, 260, andair gap spacers 262. The insulating material layers include lowersidewall spacers 234, conformal insulating liners 250, and dielectriccapping layers 260. The lower sidewall spacers 234 electrically insulatethe metal gate structures 230-1, 230-2, 230-3 from the adjacentsource/drain regions 223. The conformal insulating liners 250 (which aresimilar in composition and function as the conformal insulating liner155 of the BEOL structure, FIG. 1A) conformally cover the sidewallsurfaces of the MOL device contacts 240/245 and the metal gatestructures 230-1, 230-2, 230-3. The conformal insulating liners 250 areoptional features that can be formed to protect the MOL device contacts240/245 and the metal gate structures 230-1, 230-2, 230-3 from potentialstructural damage or contamination which can result from subsequentprocessing steps and environmental conditions.

In accordance with embodiments of the invention, the dielectric cappinglayers 260 are formed by depositing a low-k dielectric material using apinch-off deposition process to encapsulate the upper regions of themetal gate structures 230-1, 230-2, 230-3 with low-k dielectricmaterial, and to form the air gap spacers 262 between the metal gatestructures and MOL device contacts. A process flow for fabricating theair gap spacers 262 will be discussed in further detail below. As shownin FIG. 11, the air gap spacers 262 are relatively large and voluminous,and vertically extend above the metal gate structures 230-1, 230-2,230-3. For similar reasons as discussed above with regard to the BEOLair gap spacers 158 shown in FIG. 2A, the size and shape of the FEOL/MOLair gap spacers 262 shown in FIG. 11 provide improved TDDB reliability,as well as reduced capacitive coupling between the MOL device contactsand metal gate structures.

For example, the large voluminous air gap spacers 262 reduce theeffective dielectric constant in the space between the metal gatestructures 230-1, 230-2, 230-3 and the MOL device contacts 240/245. Inaddition, since the air gap spacers 262 extend above the metal gatestructures 230-1, 230-2, 230-3, as shown in FIG. 11, there is arelatively long diffusion/conducting path P between the criticalinterfaces of the metal gate structures 230-1, 230-2, 230-3 (thecritical interfaces being an interface between the dielectric cappinglayers 260 and the upper surfaces of the metal gate structures 230-1,230-2, 230-3) and the adjacent MOL device contacts 240/245. As such, theair gap spacers 262 in FIG. 11 serve to increase the TDDB reliability ofthe FEOL/MOL semiconductor structure.

FIG. 11 further illustrates a first interconnect level of a BEOLstructure formed over the FEOL/MOL layers, wherein the firstinterconnect level comprises an ILD layer 270, and a plurality of metallines 272/274 formed in the ILD layer 270 in electrical contact withrespective MOL device contacts 240/245. The metal lines 272/274 areformed by etching openings (e.g., trenches or vias) in the ILD layer270, lining the openings with barrier liner layers 272 and filling theopenings with metallic material 274 such as copper, using knowntechniques.

A process flow for fabricating the semiconductor device 200 of FIG. 11will now be discussed in further detail with reference to FIGS. 12through 19, which schematically illustrate the semiconductor device 200at various stages of fabrication. To begin, FIG. 12 is cross-sectionalschematic view of the semiconductor device 200 at an intermediate stageof fabrication in which vertical transistor structures M1, M2 and M3 areformed on the semiconductor substrate 210/215. In one embodiment, thesubstrate 210/215 comprises a SOI (silicon on insulator) substrate,wherein the base substrate 210 is formed of silicon, or other types ofsemiconductor substrate materials that are commonly used in bulksemiconductor fabrication processes such as germanium, silicon-germaniumalloy, silicon carbide, silicon-germanium carbide alloy, or compoundsemiconductor materials (e.g. III-V and II-VI). Non-limiting examples ofcompound semiconductor materials include gallium arsenide, indiumarsenide, and indium phosphide. The insulating layer 215 (e.g., oxidelayer) is disposed between the base semiconductor substrate 210 and anactive semiconductor layer (e.g., active silicon layer), wherein theactive semiconductor layer is patterned using known methods to fabricatethe semiconductor fin structure 220. Moreover, the epitaxialsource/drain regions 225 can be epitaxially grown on exposed portions ofthe semiconductor fin structure 220 using know methods.

As further shown in FIG. 12, the metal gate structures 230-1, 230-2 and230-3 are encapsulated in insulating/dielectric material structuresincluding insulating capping layers 232, and sidewall spacers 234. Thecapping layers 232 and sidewall spacers 234 are fabricated using knowntechniques and insulating materials (e.g., SiN). The metal gatestructures 230-1, 230-2, and 230-3 can be formed, for example, by a RMG(replacement metal gate) process in which dummy gate structures areinitially formed, and then replaced with the metal gate structures230-1, 230-2, 230-3 after formation of the epitaxial source/drainregions 225, but prior to formation of the MOL device contacts. In theembodiment of FIG. 12, it is assumed that an RMG process has beencompleted resulting in the formation of the metal gate structures 230-1,230-2, 230-3, and that a PMD (pre-metal dielectric) layer 236 has beendeposited and planarized, resulting in the structure shown in FIG. 12.

The PMD layer 236 is formed by depositing a layer of dielectric materialover the surface of the semiconductor device, and then planarizing thedielectric material down to the upper surface of the capping layers 232.The PMD layer 236 may be formed with any suitable insulating/dielectricmaterials such as, for example, silicon oxide, silicon nitride,hydrogenated silicon carbon oxide, silicon based low-k dielectrics,porous dielectrics, or organic dielectrics including porous organicdielectrics, etc. The PMD layer 236 may be formed using known depositiontechniques, such as, for example, ALD, CVD, PECVD, spin on deposition,or PVD, followed by a standard planarization process (e.g., CMP).

A next process module includes forming the MOL device contacts using aprocess flow as schematically illustrated in FIGS. 13, 14 and 15. Inparticular, FIG. 13 is cross-sectional schematic side view of thesemiconductor device of FIG. 12 after patterning the PMD layer 236 toform contact openings 236-1 between the gate structures 230-1, 230-2,230-3 of the vertical transistor structures M1, M2, M3 down to thesource/drain regions 225. The contact openings 236-1 can be formed usingknown etching techniques and etching chemistries to etch the material ofthe PMD layer 236 selective to the insulating material of the cappinglayers 232 and sidewall spacers 234.

Next, FIG. 14 is cross-sectional schematic side view of thesemiconductor device of FIG. 13 after depositing a conformal liner layer240A over the surface of the semiconductor device. The conformal linerlayer 240A may include a material such as TaN, etc., which serves as abarrier diffusion layer and/or adhesion layer for the metallic materialthat is used to fill the openings 236-1 and form the MOL devicecontacts. Next, FIG. 15 is a cross-sectional schematic side view of thesemiconductor device of FIG. 14, after depositing a layer of metallicmaterial to fill the contact openings 236-1 between the metal gatestructures 230-1, 230-2, 230-3 with conductive material 245 andplanarizing the surface of the semiconductor device down to the gatecapping layers 232 to remove the overburden liner and conductivematerials, and thereby form the MOL device contacts 240/245. Theconductive material 245 may comprise copper, tungsten, cobalt, aluminum,or other conductive materials that are suitable for use in formingvertical MOL device contacts to the source/drain regions and gateelectrodes.

While not specifically shown in FIG. 15, MOL gate contacts can be formedin openings that are formed through the PMD layer 236 and capping layers232 down to an upper surface of the metal gate structures 230-1, 230-2,and 230-3. It is to be understood that the metal gate structures 230-1,230-2, 230-3 extend in the Y-Y direction (in and out of the plane of thedrawing sheet, based on the Cartesian coordinate system shown in FIG.11) and, therefore, the MOL gate contacts can be formed in the PMD layer236 in alignment with the extended end portions of the metal gatestructures 230-1, 230-2, 230-3, as is understood by one of ordinaryskill in the art.

Following formation of the MOL device contacts, a next process moduleincludes forming air gap spacers between the metal gate structures andthe MOL device contacts, using a process flow as schematicallyillustrated in FIGS. 16-19. An initial step in this process includesetching the gate capping layers 232 and sidewall spacers 234. Inparticular, FIG. 16 is a cross-sectional side view of the semiconductordevice of FIG. 15 after etching away the gate capping layers 232 andrecessing the sidewall spacers 234 down to an upper surface of thesemiconductor fin structure 220, thereby forming narrow spaces S betweenthe sidewalls of the metal gate structures 230-1, 230-2, 230-3 andadjacent MOL device contacts 240/245. While the example embodiment ofFIG. 16 shows that the gate capping layers 232 are completely etchedaway, in an alternate embodiment, the etch process can be implementedsuch that a thin layer of the etched gate capping layers 232 remains onthe top surfaces of the metal gate structures 230-1, 230-2, 230-3.

Next, FIG. 17 is a cross-sectional schematic side view of thesemiconductor device of FIG. 16 after depositing a conformal layer ofinsulating material 250A to form an insulating liner on the exposedsurfaces of the metal gate structures 230-1, 230-2, 230-3, and the MOLdevice contacts 240/245. The conformal insulating liner layer 250A is anoptional protective feature that may be formed prior to the pinch-offdeposition process to provide added protection to the exposed surfacesof the metal gate structures 230-1, 230-2, 230-3, and the MOL devicecontacts 240/245, for the same or similar reasons as discussed above.

Further, the conformal insulating liner layer 250A can be formed of oneor more robust ultrathin layers of dielectric material which havedesired electrical and mechanical characteristics such as low leakage,high electrical breakdown, hydrophobic, etc., and which can sustain lowdamage from subsequent semiconductor processing steps. For example, theconformal insulating liner layer 250A can be formed of a dielectricmaterial such as SiN, SiCN, SiNO, SiCNO, SiC or other dielectricmaterials having desired electrical/mechanical properties as notedabove. In one embodiment, when the spacing S (FIG. 16) is in a range ofabout 4 nm to about 15 nm, the conformal insulating liner layer 250A isformed with a thickness in a range of about 1.0 nm to about 2 nm,thereby reducing the spacing S by about 2 nm, to about 4 nm by virtue ofthe liner layer 250A on the sidewalls of the adjacent structures.

Similar to the BEOL embodiments discussed above, the conformalinsulating liner layer 250A can be formed of multiple conformal layersof the same or different dielectric materials, which are deposited usinga cyclic deposition process. For example, in one embodiment, theconformal insulating liner layer 250A can be formed of multiple thinconformal layers of SiN which are sequentially deposited to form a SiNliner layer that has a total desired thickness (e.g., using a plasma CVDor CVD process with Silane and NH3 to cyclically deposit 0.1 nm-0.2 nmthick SiN layers).

A next step in the fabrication process comprises depositing dielectricmaterial over the semiconductor structure of FIG. 17 using a pinch-offdeposition process to form air gap spacers between the metal gatestructures and MOL device contacts. For example, FIG. 18 is across-sectional schematic side view of the semiconductor device of FIG.17 after depositing a layer of dielectric material 260A using anon-conformal deposition process to cause pinch-off regions that formthe air gap spacers 262 in the narrow spaces between the metal gatestructures 230-1, 230-2, 230-3 and adjacent MOL device contacts 240/245.As discussed above, in accordance with embodiments of the invention, thestructural characteristics (e.g., size, shape, volume, etc.) of the airgap spacers 262 that are formed by pinch-off deposition can becontrolled, for example, based on (i) the type of dielectric material(s)that are used to form the dielectric layer 260A, and/or (ii) thedeposition process and associated deposition parameters (e.g., gas flowrate, RF power, pressure, deposition rate, etc.) that are used toperform the pinch-off deposition.

For example, in one embodiment of the invention, the layer of dielectricmaterial 260A is formed by PECVD deposition of a low-k dielectricmaterial (e.g., k in a range of about 2.0 to about 5.0). Such low-kdielectric material includes, but is not limited to, SiCOH, porousp-SiCOH, SiCN, SiNO, carbon-rich SiCNH, p-SiCNH, SiN, SiC, etc. A SiCOHdielectric material has a dielectric constant k=2.7, and a porous SiCOHmaterial has a dielectric constant of about 2.3-2.4. In one exampleembodiment of the invention, a pinch-off deposition process isimplemented by depositing a SiN dielectric film via a plasma CVDdeposition process using an industrial parallel plate single wafer 300mm CVD reactor with the following deposition parameters: gas [Silane(100-500 sccm) and Ammonia (200-1000 sccm)]; RF power [200-600 Watts];pressure [1-8 Torr]; and deposition rates [0.5-8 nm/sec].

FIG. 19 is a cross-sectional schematic side view of the semiconductordevice of FIG. 18 after planarizing the surface of the semiconductordevice down to the MOL device contacts and depositing an ILD layer 270as part of a first interconnect level of a BEOL structure. Thesemiconductor structure of FIG. 18 can be planarized using a standardCMP process, wherein the CMP process is performed to remove theoverburden dielectric material 260A and portions of the insulating linerlayer 250A disposed on top of the MOL device contacts, resulting in thestructure shown in FIG. 19. As shown in FIG. 19, the remaining portionsof the pinch-off deposited dielectric material 260A form separatedielectric capping structures 260 over the metal gate structures 230-1,230-2, 230-3, and separate insulating liners 250. Although notspecifically shown in FIGS. 11 and 19, prior to formation of the ILDlayer 270, an additional capping layer can be formed on the planarizedFEOL/MOL surface to insulate the conductive material 245 of the MOLdevice contacts from the dielectric material of the ILD layer 270.

Experimental test structures have been fabricated based on thesemiconductor structure schematically illustrated in FIG. 11, whereinthe conformal insulating liners 250 were formed with cyclic SiN filmswith thicknesses of 1 nm, 1.5 nm, 2 nm, and 3 nm, and wherein thepinch-off deposition was performed using PECVD SiCN fills and PECVD ULKfilms with k=2.7 and 2.4. The experimental results demonstrated thatlarge voluminous air gap spacers (air gap spacers 262 schematicallyillustrated in FIG. 11) can be obtained, which extend above the metalgate structures. In addition, experimental results have demonstratedthat the size, shape, volume, etc. of air gap spacers can be optimizedfor different applications by varying deposition process parameters orthe materials used for pinch-off deposition.

It is to be understood that the methods discussed herein for fabricatingair gap spacers in FEOL/MOL or BEOL layers can be incorporated withinsemiconductor processing flows for fabricating semiconductor devices andintegrated circuits with various analog and digital circuitry ormixed-signal circuitry. In particular, integrated circuit dies can befabricated with various devices such as field-effect transistors,bipolar transistors, metal-oxide-semiconductor transistors, diodes,capacitors, inductors, etc. An integrated circuit in accordance with thepresent invention can be employed in applications, hardware, and/orelectronic systems. Suitable hardware and systems for implementing theinvention may include, but are not limited to, personal computers,communication networks, electronic commerce systems, portablecommunications devices (e.g., cell phones), solid-state media storagedevices, functional circuitry, etc. Systems and hardware incorporatingsuch integrated circuits are considered part of the embodimentsdescribed herein. Given the teachings of the invention provided herein,one of ordinary skill in the art will be able to contemplate otherimplementations and applications of the techniques of the invention.

Although exemplary embodiments have been described herein with referenceto the accompanying figures, it is to be understood that the inventionis not limited to those precise embodiments, and that various otherchanges and modifications may be made therein by one skilled in the artwithout departing from the scope of the appended claims.

We claim:
 1. A semiconductor device, comprising: a first metallicstructure and a second metallic structure disposed adjacent to eachother on a substrate with a space disposed between the first and secondmetallic structures, wherein the first metallic structure comprises agate structure of a transistor and wherein the second metallic structurecomprises a source/drain contact; and a dielectric capping layer formedover the first and second metallic structures to form an air gap in thespace between the first and second metallic structures; wherein an upperportion of the air gap is disposed above an upper surface the firstmetallic structure and below an upper surface of the second metallicstructure; and wherein a bottom portion of the air gap is disposed belowa bottom surface of the second metallic structure.
 2. The device ofclaim 1, wherein the dielectric capping layer comprises a low-kdielectric material having a dielectric constant that is about 5.0 orless.
 3. The device of claim 1, wherein the dielectric capping layercomprises at least one of SiCOH, porous p-SiCOH, SiCN, SiNO, carbon-richSiCNH, SiC, p-SiCNH, and SiN.
 4. The device of claim 1, furthercomprising a conformal liner layer formed on surfaces of the first andsecond metallic structures in the space between the first and secondmetallic structures.
 5. The device of claim 1, further comprising: aBEOL (back-end-of-line) interconnect structure comprising a first metalline and a second metal line formed in an ILD (interlevel dielectric)layer, wherein the first metal line and the second metal line aredisposed adjacent to each other with a space disposed between the firstand second metal lines; a second dielectric capping layer formed overthe first and second metal lines to form an air gap in the space betweenthe first and second metallic lines; wherein an upper portion of the airgap is disposed above upper surfaces of the first and second metallines.
 6. The device of claim 5, wherein the second dielectric cappinglayer comprises a low-k dielectric material having a dielectric constantthat is about 5.0 or less.
 7. The device of claim 5, wherein the seconddielectric capping layer comprises at least one of SiCOH, porousp-SiCOH, SiCN, SiNO, carbon-rich SiCNH, SiC, p-SiCNH, and SiN.
 8. Thedevice of claim 5, further comprising a conformal liner layer within thespace between the first and second metal lines.